MRC | Criteria | Characteristic |
---|---|---|
AEHX | MAXIMUM POWER DISSIPATION RATING | 635.0 MILLIWATTS |
CQZP | INPUT CIRCUIT PATTERN | 14 INPUT |
CQWX | OUTPUT LOGIC FORM | N-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
AFGA | OPERATING TEMP RANGE | -55.0 TO 100.0 DEG CELSIUS |
ADAQ | BODY LENGTH | 1.290 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.210 INCHES NOMINAL |
CQSJ | INCLOSURE MATERIAL | CERAMIC |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEQ | TIME RATING PER CHACTERISTIC | 450.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME, LOW TO HIGH LEVEL OUTPUT |
CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND ULTRAVIOLET ERASABLE AND PROGRAMMABLE |
AFJQ | STORAGE TEMP RANGE | -65.0 TO 125.0 DEG CELSIUS |
CZER | MEMORY DEVICE TYPE | ROM |
ADAT | BODY WIDTH | 0.500 INCHES MINIMUM AND 0.610 INCHES MAXIMUM |
CRHL | (NON-CORE DATA) BIT QUANTITY | 16384 |
AFGA | OPERATING TEMP RANGE | -55.0/+100.0 DEG CELSIUS |
AFGA | OPERATING TEMP RANGE | 55.0/+100.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -65.0/+125.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | 65.0/+125.0 DEG CELSIUS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CSWJ | (NON-CORE DATA) WORD QUANTITY | 2048 |
TTQY | TERMINAL TYPE AND QUANTITY | 24 PRINTED CIRCUIT |
TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS, INDIVIDUAL MANUFACTUREER STANDARDS, ETC.). |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 26.5 VOLTS MAXIMUM POWER SOURCE |
CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | D-3 MIL-M-38510 |
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